Miyachi America is best known for its resistance and laser welding technologies. To complement these well-established processes, Micro TIG welding was recently added to our product line. The Micro TIG process expands our process offering, particularly for materials such as copper. This blog veers away from our normal, application specific format to provide a quick introduction to the Micro TIG process:
What do you get when you pair a non-contact, high intensity heat source with a compact, relatively inexpensive high speed motion system? A perfect match! The "ham n' eggs" of laser industry: a micro laser welding system that can push productivity to the max with three key features:
Resistance spot welding monitors and checkers measure the electrical and mechanical aspects of the welding process; they analyze weld quality enabling the user to make adjustments and improvements resulting in process stability, and, ultimately, improved yields. Here’s a quick look at the three most important reasons to consider adding a weld monitor or weld checker to your resistance welding line:
Microsecond fiber and pulsed Nd:YAG lasers have been used successfully for hypo tube and stent cutting for many years. The only downside is that cut parts often require a number of post processing operations, depending on material and part requirements. These additional manufacturing steps can add significant cost; they also add to the handling logistics burden for what, in many cases, are mechanically delicate parts, not to mention the added problem of having to deal with chemical-based processes and the disposal of hazardous waste.
"Ugh - my battery just died!" "Can I use your charger?" "Mind if I recharge my phone?" Batteries are everywhere, and we've become increasingly dependent on them in many aspects of our daily lives: portable electronic devices, cordless power tools, energy storage, and hybrid and EV cars. Thus, the demand to manufacture batteries that meet or exceed quality and production requirements for these products, is great.
Resistance spot welding, micro TIG welding, and laser welding processes all enable high quality volume production. The selection of one technology over another is usually made based on the application's specific requirements and the alignment of the technology to these needs.
Once the commercial justification for bringing laser technology in house is complete, new to laser manufacturers may still have some technical concerns. We’ve recently worked on several very successful collaborations with first-time to laser manufacturers to turn their mountains into mole hills. Now each system is on the floor in production and everyone is wondering what all the fuss was about.
2D Data Matrix TM codes are made up of two parts: the finder pattern that tells the reader the code orientation and array size, and the actual encoded data. If you’re getting no read or a marginal read, you may have an issue with one these read factors. It’s also worth noting that the quality (and price) of the reader can have a significant effect – particularly on small codes, and codes marked on shiny surfaces.
Most industrial laser marking applications are small and precise. But every now and then, an application comes along requiring a large area mark – with fill - and that generally means long process times, which no manufacturer likes to hear. Fortunately, there are several tricks of the trade that can greatly reduce process time, and, in some cases, the optimized process time can be significantly improved.
You've been successfully running the same resistance spot welding program for days - months - years when all of a sudden it stopped working. What do you do? Where should you start? When troubleshooting a problem with your resistance welding process, we've learned that it's best to start with the materials and move back toward the power supply. Troubleshoot using 7 simple steps, in this order:
Most PCB materials like FR2 and FR4 are very resilient to the application of heat during the hot bar reflow soldering (or hot bar bonding) process. But some materials - ceramic substrates in particular - need to be heated in a more controlled fashion to minimize the chance of cracking. Excessive differences in the heat sinking capability of the two parts being joined can also cause solder cracking during cooling. Heat sinking differentials along the solder joint length are the most common design problem to overcome. Small differences may not have much effect on quality, but any large thermal mass change along the joint area will cause inconsistency of temperature and result in a poor solder joint.